| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with a bump whose sealing layer has no void and a method for assembling the same, in which the production process can be significantly improved by an epoxy resin composition capable of developing a B-stage state. <P>SOLUTION: The epoxy resin composition comprises an epoxy resin (A) which contains two or more epoxy groups per a molecule and is liquid at 25°C, an epoxy resin (B) which contains two or more epoxy groups per a molecule, is solid at 25°C, and has an epoxy equivalent of 200 or more, and a curing agent (C) which has both an aromatic carboxy group and an aromatic hydroxy group and has a melting point of 180°C or higher. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
