| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method by which the shape of a blade cutting section can be kept flat or projected, without making such a special blade having a lower wearing rate at the central part of the blade in the direction of thickness than in the peripheral part thereof, or generating a loss in time required for sharpening while using an accelerating liquid for accelerating dissolution of a blade bonding material. SOLUTION: Diamond abrasive grains are dispersed in a bonding material made mainly of nickel to form a blade 101. When a semiconductor wafer 105 is cut by using the blade 101, a cutting liquid 106 made of ultrapure water containing carbonic acid to dissolve the bonding material of the blade 101 is supplied to the blade 101. The abrasive grains at the central part of the cutting face of the blade 101 are exposed accompanied with the dissolution of the blade 101, so that their dulling can be prevented and no stress is given to the central part of the cutting face thereof. Therefore, the shape of the cutting face of the blade 101 can be kept flat or projected. COPYRIGHT: (C)2006,JPO&NCIPI |
