| 摘要 |
PROBLEM TO BE SOLVED: To improve quality of a substrate by eliminating bleeding and projection caused by a connecting pad for interlayer connection formed by screen printing method in the manufacture of a multilayer ceramic substrate. SOLUTION: In the manufacture of the multilayer ceramic substrate, conductor paste is filled into via-holes 111 worked on the green sheet 112 of ceramics and, thereafter, at least one layer or more of screens 101 with a circuit pattern 110 formed thereon by screen printing method employing the screen 101 without connecting pad between upper and lower layers are used as an inner layer to laminate, then, pressurizing adhesion or pressurizing calcination is applied. COPYRIGHT: (C)2006,JPO&NCIPI |
