| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounted board inspection device capable of inspecting with high precision a joined state of a mounted component joined with solder on a printed board. SOLUTION: The inspection device is equipped with a laser instrumentation portion for finding data on the height of an object to be inspected on an inspection board by laser triangulation, an X-ray instrumentation portion for finding height data by calculating a cross-sectional shape of the object to be inspected from an X-ray transmission image obtained by irradiating the board with X-rays and photographing, and an instrumentation inspection unit for calculating an angle of inclination of the external shape of the object to be inspected from the height data acquired by measurement in the laser instrumentation portion, and selectively changing the height data acquired in the laser instrumentation portion and the height data acquired in the X-ray instrumentation portion on the basis of the calculated angle of inclination. COPYRIGHT: (C)2006,JPO&NCIPI |
