| 摘要 |
PROBLEM TO BE SOLVED: To facilitate metallic joining by simplifying a structure relating to cleaning treatment of a workpiece. SOLUTION: The subject joining equipment 101 is provided with a suction nozzle 11 for holding an electronic component 1, a base plate stage 9 for holding a circuit board 2 oppositely faced to the electronic component, and an excimer ultraviolet ray lamp 21 that can be arranged at an irradiation position between the electronic component and the circuit board which are finished with positioning. In such joining equipment, the irradiation of the ultraviolet rays for a gold bump of the electronic component and for the electrode of the circuit board is simultaneously carried out with the excimer ultraviolet ray lamp. After the cleaning treatment on both metallic parts, ultrasonic vibration is imparted to the metallic parts in contact with each other to perform the metallic joining on them. COPYRIGHT: (C)2006,JPO&NCIPI |
