发明名称 WORKPIECE HOLDING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a workpiece holding device which can suppress the generation of abrasion phenomena and can prevent the melting of a tape stuck on a workpiece even when a laser beam has been irradiated thereon. <P>SOLUTION: This workpiece holding device 36 is used in a laser beam machine for machining the workpiece by irradiating laser beam on the workpiece having the tape stuck thereon. The workpiece holding device 36 has a workpiece holding portion 361 for holding the surface 361a of the workpiece, on which surface the tape has been stuck. The material of at least the holding surface 361a side of the workpiece holding portion 361 is polytetrafluoroethylene (PTFE). By this configuration, the abrasion phenomena is hardly caused on the holding surface 361a side of the workpiece holding portion 361 even when the laser beam has been irradiated thereon because the holding surface 361a of the workpiece holding portion 361 is made of the PTFE having a low absorption factor for laser beam energy. As a result, the tape stuck on the workpiece does not melt, because the workpiece holding portion 361 is not excessively heated. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006007250(A) 申请公布日期 2006.01.12
申请号 JP20040185490 申请日期 2004.06.23
申请人 DISCO ABRASIVE SYST LTD 发明人 MORIKAZU YOJI
分类号 B23K26/10 主分类号 B23K26/10
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