| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems wherein a plurality of probes 52 mounted to a contactor 51 are not in parallel with a printed-wiring board 53 and the contact failure between each probe 52 and the printed-wiring board 53 results although the contactor 51 is allowed to be in parallel with a wafer W by utilizing a pressure adjustment mechanism 56 when the a probe card 5 fitted into the probe device is no longer in parallel with the wafer W on a main chuck 3 in a probe device in the conventional probe card 5. SOLUTION: The probe card 10 comprises a contactor 11, a printed-wiring board 12, and a reinforcing member 13, is fitted to the probe device (not shown) for use via a card holder 14, and a parallelism adjustment mechanism 15 for adjusting the parallelism between the contactor 11 and the wafer W arranged on a main chuck 50 in the prober device is provided at the outer periphery section of the probe card 10. COPYRIGHT: (C)2006,JPO&NCIPI
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