| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, free from a halogen-based flame retardant and an antimony compound, and having excellent characteristics in flame retardancy, high-temperature preservation characteristics and high-temperature energizing characteristics. SOLUTION: The epoxy resin composition usable for sealing a semiconductor device usable for an electronic component requiring the guaranty of operating under a high-temperature environment over 150°C comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) aluminum hydroxide represented by the general formula (1): Al<SB>2</SB>O<SB>3</SB>(H<SB>2</SB>O)<SB>n</SB>(wherein, n is a number within the range of 2<n<3) and (F) a solid solution of a metal oxide represented by the general formula (2): Mg<SB>(1-x)</SB>M<SP>2+</SP><SB>x</SB>(OH)<SB>2</SB>(wherein, M<SP>2+</SP>is at least one kind of a divalent metal ion selected from the group consisting of Mn<SP>2+</SP>, Fe<SP>2+</SP>, Co<SP>2+</SP>, Ni<SP>2+</SP>, Cu<SP>2+</SP>and Zn<SP>2+</SP>; and x is a number within the range of 0.01≤x≤0.5) as essential components. COPYRIGHT: (C)2006,JPO&NCIPI
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