发明名称 |
HOUSING FOR ELECTRONIC BOARDS |
摘要 |
The invention relates to a housing for electronic boards (10), which comprises at least one heat-generating component (11) and which is of the type that comprises side walls (2, 3, 4 and 5) and a base (6). The invention is characterised in that the base (6) comprises a series of ribs (7, 8) with boxes (9) disposed therebetween. According to the invention, the aforementioned boxes (9) are designed to receive a resin (13) at the point corresponding to the position of the heat-generating component, said resin being intended to facilitate heat exchange between the inside and the outside of the housing (1). |
申请公布号 |
WO2005101940(A3) |
申请公布日期 |
2006.01.12 |
申请号 |
WO2005FR00812 |
申请日期 |
2005.04.04 |
申请人 |
VALEO ELECTRONIQUE ET SYSTEMES DE LIAISON;LEXUAN, JEAN;BOURSEAU, ERIC |
发明人 |
LEXUAN, JEAN;BOURSEAU, ERIC |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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