发明名称 HOUSING FOR ELECTRONIC BOARDS
摘要 The invention relates to a housing for electronic boards (10), which comprises at least one heat-generating component (11) and which is of the type that comprises side walls (2, 3, 4 and 5) and a base (6). The invention is characterised in that the base (6) comprises a series of ribs (7, 8) with boxes (9) disposed therebetween. According to the invention, the aforementioned boxes (9) are designed to receive a resin (13) at the point corresponding to the position of the heat-generating component, said resin being intended to facilitate heat exchange between the inside and the outside of the housing (1).
申请公布号 WO2005101940(A3) 申请公布日期 2006.01.12
申请号 WO2005FR00812 申请日期 2005.04.04
申请人 VALEO ELECTRONIQUE ET SYSTEMES DE LIAISON;LEXUAN, JEAN;BOURSEAU, ERIC 发明人 LEXUAN, JEAN;BOURSEAU, ERIC
分类号 H05K7/20 主分类号 H05K7/20
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