| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode of high heat dissipation, and to provide a method of manufacturing the light-emitting diode. <P>SOLUTION: A light-emitting diode having an adhesive layer and a method of manufacturing the light-emitting diode are disclosed. An adhesive layer, having a thickness of about 0.1 μm to 1 μm, is used to bond an LED stack and a high heat-dissipating substrate, wherein the substrate has thermal conductivity equal to or higher than 100 W/mk. The present invention enhances the heat-dissipation effect of a light-emitting diode so as to improve the stability and light-emitting efficiency of the light-emitting diode. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
