| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet stripper and a stripping method for stripping unwanted parts efficiently, after an adhesive sheet is stuck to a wafer. SOLUTION: After a rolled material LS, where a heat-sensitive adhesive sheet S has been laminated onto a stripping sheet PS, is stuck to a semiconductor wafer W, the sheet stripper 50 cuts the rolled material along the outer circumference of the semiconductor wafer, to separate the stripping sheet PS located on the semiconductor wafer from the rolled material part S1 located on the outer circumferential side of the semiconductor wafer. The sheet stripper comprises a roll 135 movable relative to a table 47 for supporting the wafer W, and only the adhesive sheet S is left on the wafer W by sticking a strip tape ST to the rolled material LS by means of the roll and then winding and stripping that tape. COPYRIGHT: (C)2006,JPO&NCIPI |
