| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of reducing the time required by a wafer to reach the saturation temperature and the temperature difference in the surface of the wafer. SOLUTION: One main surface of a plate member 8 is a placement surface 8a on which the wafer is placed, and the other main surface or the interior of the plate member 8 is provided with an attracting electrode 6. In the one main surface 8a of the plate member 8, there are a through-hole 5, a plurality of convex parts 8b, an annular convex part 8c provided in the periphery, and grooves 8d provided between these convex parts 8b, 8c. The plan view of the convex part 8b consists of four sides and flection lines connecting these four sides, and the convex parts 8b are evenly provided in the placement surface 8a. COPYRIGHT: (C)2006,JPO&NCIPI |
