| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer treatment apparatus in which a treatment liquid can be prevented from being residual in a rotor and liquid medicine resistance performance can be improved. SOLUTION: In a wafer treatment apparatus, edges of a wafer W are held by a plurality of holding members 40A, 40B, 40C, 40D provided in a rotor and the wafer W is rotated by the rotor for treatment. The wafer treatment apparatus comprises supporting members 41A, 41B, 41C, 41D for supporting the holding members 40A, 40B, 40C, 40D and a gap 75 is formed between the holding members 40A, 40B, 40C, 40D and the supporting members 41A, 41B, 41C, 41D. COPYRIGHT: (C)2006,JPO&NCIPI |
