| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which does not have burs when sealed with resin, and a method for manufacturing the electronic component. SOLUTION: The electronic component has a base 2 having a storage recess 21 where a semiconductor device 1 is stored and a conductive pattern 3 which is provided inside and outside the storage recess 21 and electrically connected to the semiconductor device 1. Dam resin 4 which covers the border between a conductive pattern 3 and the base 2 is provided at both sides of respective conductive patterns 3 in the peripheral direction of the opening of the storage recess 21. When the storage recess 21 is filled with the sealing resin 4, the sealing resin which moves between the conductive pattern 3 and base 2 is checked by the dam resin 4, so that no bur is formed. COPYRIGHT: (C)2006,JPO&NCIPI
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