| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package with high heat dissipation even when any material is used for a board material, and to provide a manufacturing method thereof. SOLUTION: The semiconductor package 15 is provided with a insulating board 1, an electric circuit 10 formed on the front side of the board 1, and a semiconductor element 11 mounted on the front side of the board 1. Further, the package includes: a high heat conduction layer 20 located on the rear side of the board 1; bottomed-holes 25 provided to a non-circuit location part 4 beneath the semiconductor element 11 of the board and whose bottom uses the high heat conduction layer 20; and a high heat conduction member 30 filled in the bottomed-holes 25 and comprising a material with a high heat conductivity. COPYRIGHT: (C)2006,JPO&NCIPI |
