| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type electronic component for reducing the adhesion failure of external electrodes, and for strengthening the adhesiveness of metallic components configuring the external electrodes with a conductor layer formed in the electronic component main body. SOLUTION: Conductive paste containing metallic powder and glass powder is applied to the end of an electronic component main body 1 having a conductor layer 1c inside a ceramic layered product 1b, so that a chip type electronic component can be formed by two or more baking processes. This chip type electronic component is provided with an external electrode 3 in which the rates of metallic components, glass components and voids range from 80 to 85%, 10 to 15% and 0 to 5% by a mass ratio (volume ratio), respectively. COPYRIGHT: (C)2006,JPO&NCIPI |
