| 摘要 |
PROBLEM TO BE SOLVED: To provide a MEMS structural body which can improve a yield by preventing an electric short circuit accident when an wafer substrate and a movable portion, to which different polarities are given, are inevitably brought into contact with each other, and which has a low manufacturing cost. SOLUTION: The MEMS structural body is composed of a wafer base having an oxide film arranged between lower silicon layers, a fixed portion to be integrally connected to the wafer base, and a movable portion arranged on the fixed portion so as to float. The MEMS structural body includes a floating space (R) formed on the lower silicon layer (113) with a constant depth by the dry etching such that the movable portion (100b) is floated by the etching gas supplied from the etching hole which is formed on an upper silicon layer (111) by the primary dry etching, and from which etching hole, an oxide film on the bottom surface is removed by a secondary dry etching, and a short circuit preventing oxide film (112a) remaining on the lower surface of the movable portion (100b) so as to correspond to the lower silicon layer (113) across the floating space (R). COPYRIGHT: (C)2006,JPO&NCIPI
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