| 摘要 |
The invention relates to a radiation sensor device comprising a housing, a radiation sensor secured with respect to a first portion of the housing and a heat pipe in thermal communication with the first portion of the housing, the heat pipe being configured to transfer heat from portion of the house to a second portion of the housing remote from the first portion of the housing. The heat pipe may be used advantageously to transport or transfer heat away from the sensor components of the device to an area remote therefrom. The heat pipe can be used to transfer heat at a rate that is thousands of times higher than copper. The radiation sensor device may be used in an ultraviolet radiation fluid treatment system such as an ultraviolet radiation water disinfection system.
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