| 摘要 |
<p>A first conductive member and a second conductive member having different Seebeck coefficients are formed on an insulating substrate, and they are connected with an ohmic contact and the surfaces connected with an ohmic contact are covered with a material sheet being excellent in heat conductivity and having an electric insulating property at the junction surface, for example, an aluminum sheet provided on the surface thereof with an electric insulating property by alumite processing or the like. And, bonding wires are connected to the opposite-side surfaces of the first and second conductive members by ohmic contacts, and the bonding wires are insulated from each other to use them as the output terminals of an integrated parallel Peltier/Seebeck element chip. A plurality of integrated parallel Peltier/Seebeck element chips thus produced are connected with serial or parallel cables to obtain an electric-to-thermal conversion device and a heat energy transfer device.</p> |
