| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip device whose environmental resistance is improved by preventing a dielectric breakdown due to dew condensation. SOLUTION: The chip device which is stored in a package having an internal space and equipped with a structure having, for example, an electric circuit constituted on a substrate 40 is provided with a dew condensation part 57 made of a metal thin film on the surface where the electric circuit is not provided. In a state wherein dewing is caused, a dew can be formed selectively and preferentially at the dew condensation part 57 to prevent dewing at a dangerous place. COPYRIGHT: (C)2006,JPO&NCIPI |
