| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive resin material for mounting electronic parts with anisotropic conductivity, which can give an electronic device mounting electronic parts on a circuit board and excelling in reliabilty, and to provide the electronic device obtained by using it. SOLUTION: The adhesive resin material for mounting electronic parts comprises (A) a thermosetting resin, (B) 1-40 mass% of conductive particles having a mean particle diameter of 1-20μm, (C) 0.01-10 mass% of light blocking fine particles whose mean particle diameter is in the range of 0.001-0.2 times that of the above component (B), and it has, in a cured film 25μm thick, an average light transmittance of≤10% in the wavelength region of 180-2,800 nm. The electronic device is formed by mounting the electronic parts on the circuit board using the above adhesive resin material. COPYRIGHT: (C)2006,JPO&NCIPI
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