Ultrathin module for semiconductor device and method of fabricating the same

摘要

An ultrathin module is provided for special types of semiconductor devices such as image sensor devices and micro-electro-mechanical system (MEMS) devices. In the module, a chip cover is directly attached to a semiconductor chip so as to protect a light-sensing area or mechanical elements of the chip. The chip cover may also be used as a lens assembly and an infrared light filter. In a fabrication method, the chips are provided on a wafer, and the chip covers are attached to the chips, respectively, before the wafer is sliced to separate the chips from one another.