| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the degree of freedom in designing of rewiring and shorten a time required for a marking step as much as possible by simultaneously marking information included in individual semiconductor devices on a resin-packaged external terminal formation surface in a wafer state, improve the lead time of products, and to prevent the breakage of a device area due to transmission of a laser light accompanied with thinning of a silicon board. <P>SOLUTION: The semiconductor device 10 is comprised of a silicon board 11 wherein a semiconductor element is formed, a second insulating layer 21 as a packaging resin, an external metallic terminal 22 or the like. In this case, various kinds of information for identifying the semiconductor device 10 such as lot number, marks as a reference of orientation of the semiconductor device during mounting and so on, are formed on the second insulating layer 21 as a seal 27. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
