| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in productivity. <P>SOLUTION: The semiconductor device is provided with: a substrate 1 with a plurality of wiring patterns formed thereon; a first semiconductor chip 3 mounted on one side of the substrate 1; a spacer 4 mounted on the substrate 1 so as to be neighbored to the first semiconductor chip 3; and a second semiconductor chip 6 mounted on the first semiconductor chip 3 and one side of the spacer 4. The spacer 4 is formed simultaneously upon the diffusion process of the first semiconductor chip 3 and the semiconductor wafer. According to this constitution, the spacer 4 is integrated with the first semiconductor chip 3 simultaneously whereby productivity upon assembling is improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
