SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device whose reliability and productivity are improved by enabling junction by a reflow technique in a curved semiconductor device, a circuit substrate having it, and an electronic apparatus. SOLUTION: The semiconductor device 1 has a curved substrate 10 and a plurality of connection terminals 35 on the curved surface of the substrate 10, and is mounted on an opposing substrate 100 by connecting the connection terminal 35 to an electrode on the opposing substrate 100 by a brazing material. When the distance from the substrate center E of a first connection terminal 35a is r1, the distance from the substrate center E of a second connection terminal 35b is r2, the distance from a substrate curvature center C to the first connection terminal 35a is R1, the distance to the second connection terminal 35b is R2, and the thickness in melting of the brazing material when the connection terminal 35 is connected on the opposing substrate 100 via the brazing material is t; the connection terminal 35 is provided to the substrate 10 to satisfy a following formula; R1×cosäsin-1(r1/R1)}-R2×cosäsin-1(r2/R2)}