| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a surface acoustic wave element in which a transmitter side filter and a receiver side filter are formed on the same piezoelectric substrate has bad isolation characteristics. SOLUTION: In a method of manufacturing a surface acoustic wave device, a process of removing all conductor layers formed on the other main surface of a piezoelectric substrate is provided between a process of forming a conductive layer on one main surface of the piezoelectric substrate and a process of forming a plurality of surface acoustic element regions, between a process of forming a conductive layer on the other main surface of the piezoelectric substrate and a process of obtaining a plurality of surface acoustic wave elements, or a process of packaging the substrate. By eliminating all the conductor layers on the other main surface of the piezoelectric substrate, the isolation characteristics can be remarkably improved. COPYRIGHT: (C)2006,JPO&NCIPI
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