| 摘要 |
PROBLEM TO BE SOLVED: To make a solid-state image pickup apparatus small and to suppress noise occurrence caused by stray light. SOLUTION: In this solid-state image pickup apparatus, an imaging semiconductor chip 20 and a signal processing semiconductor chip 22 are laminated so that the rear side of the imaging semiconductor chip 20 where a solid-state image pickup element 30 having an imaging part is formed on the front surface faces the front side of the signal processing semiconductor chip 22 where a processing circuit for processing a signal about the solid-state image pickup element 30 is formed on the front surface, and an opening part is provided so that light from the outside is made incident on the imaging part of the solid-state image pickup element 30. Pad electrodes 32 and 36 to which bonding wire is connected are provided on the front surface of the imaging semiconductor 20 and the front surface of the signal processing semiconductor chip 22, respectively and the pad electrodes 36 are provided adjacently to an area where the imaging part of the solid-state image pickup element 30 is arranged, when the chip 20 and the chip 22 are laminated. COPYRIGHT: (C)2006,JPO&NCIPI
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