| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for an optical semiconductor device, which has excellent heat radiating quality, the excellent reliability of long-term airtightness, and further, good coupling efficiency to optical fibers, and to provide an optical semiconductor apparatus. SOLUTION: The package for storing therein an optical semiconductor device has a first base pedestal 1A for mounting the optical semiconductor device S on the center of the top surface thereof, two second base pedestals 1B sandwiching the first base pedestal 1A therebetween for providing respectively thereon respective resistors 4, a metal substrate 1 having through holes 1b, and lead terminals 3 so inserted into the through holes 1b as to be fastened thereto via sealants 2. Further, the second base pedestals 1B are formed integrally with the metal substrate 1. Moreover, the thermal conductivity and the thermal expansion coefficient of the material of the first base pedestal 1A are respectively larger and smaller than the respective ones of the material of the second base pedestals 1B, and the first base pedestal 1A is brazed to the second pedestals 1B and the metal substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
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