| 摘要 |
PROBLEM TO BE SOLVED: To provide the cooling device of a semiconductor element by which the heat of a plurality of semiconductor elements are moved to the cooling device of a refrigerant circulation type by heat pipes, and much heat can efficiently be radiated since there is a limit to the cooling of a plurality of the semiconductor elements of high heat generation in combination of a heatsink and a fan as in a conventional case. SOLUTION: Cooling plates 3 and heat pipes 4 are installed in a plurality of the semiconductor elements 1 of high heat generation for cooling them. A heat exchanger 5, a radiator 7 and a pump 8 are connected by piping, and the heat pipes 4 are thermally connected to the heat exchanger 5 of the cooling device where a refrigerant circulates. The heat of a plurality of the semiconductor elements 1 can efficiently be radiated. Since the respective heat pipes 4 are independent, they can easily be handled. Thus, the highly reliable cooling device of the semiconductor element 1 can be obtained which does not adversely affect the other semiconductor element 2 even if it breaks down. COPYRIGHT: (C)2006,JPO&NCIPI
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