| 摘要 |
PROBLEM TO BE SOLVED: To efficiently provide a mold releasing film of light type peeling without the performance lowering of a released substrate by the addition of a light peeling component and without the processability lowering of a silicone mold releasing film. SOLUTION: In the mold releasing film, a silicone resin layer is formed on at least one side of a polyester film, the peeling force of an acrylic adhesive is 0.15 N/50 mm or below, a residual adhesion ratio is 90% or above, and the amount of Si of the surface of the substrate in contact with the layer does not increase by 110% or above. COPYRIGHT: (C)2006,JPO&NCIPI
|
