发明名称 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
摘要 A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
申请公布号 US2006009130(A1) 申请公布日期 2006.01.12
申请号 US20050221924 申请日期 2005.09.09
申请人 发明人 OKUMURA KATSUYA;AOKI RIICHIROU;YAJIMA HIROMI;ISHIKAWA SEIJI;TSUJIMURA MANABU
分类号 B24B37/04 主分类号 B24B37/04
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