发明名称 |
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENTS |
摘要 |
In an electronic component mounting process for mounting electronic components (6) to a substrate (13), each of the electronic components (6) having an adhesive layer on a surface to be bonded to the substrate (13) is picked up with suction nozzle (33a) provided with individual heater (49), and a time taken for the mounting operation is so allotted that a first heating time (T1) of a duration from a moment when the suction nozzle (33a) comes into contact with the electronic component (6) for picking it up till another moment immediately before it begins a mounting motion to the substrate (13) is longer than a second heating time (T2) of a duration from the moment when the suction nozzle (33a) begins the mounting motion till another moment when it leaves the electronic component (6) mounted to the substrate (13). |
申请公布号 |
WO2005101943(A3) |
申请公布日期 |
2006.01.12 |
申请号 |
WO2005JP07276 |
申请日期 |
2005.04.08 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;HAJI, HIROSHI;OZONO, MITSURU |
发明人 |
HAJI, HIROSHI;OZONO, MITSURU |
分类号 |
H01L21/52;H01L21/00;H01L21/68;H01L21/683;H05K13/00 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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