| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method of a double-faced substrate and its apparatus capable of effectively reducing poor oxidization on a surface or/and a rear surface when double-faced polishing of the substrate is performed. <P>SOLUTION: A carrier 5 for double-faced polish is provided between top and bottom polishing plates 6 and 2 adhered to a polishing cloth 1, and a substrate 4 is set to the carrier 5 so that the both sides of the substrate 4 may be polished while making the carrier 5 rotate and revolute by the rotation of the top and bottom polishing plates 6 and 2, and supplying polishing liquid 9 to the polishing cloth 1 adhered to the top and bottom polishing plates 6 and 2. When raising the top polishing plate and taking out the substrate 4 after the polish, pure water is poured on the substrate 4 from a shower mechanism 10 to remove the remaining polishing liquid. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
