发明名称 LIQUID RESIN ADHESIVE DOT FORMING APPARATUS, STRUCTURAL BODY COMPRISING LIQUID RESIN ADHESIVE AND SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a liquid resin adhesive dot forming apparatus capable of forming a resin structural body on a substrate directly, simply and precisely, and shortening the process time without performing photoengraving as in the conventional manner. SOLUTION: The liquid resin adhesive dot forming apparatus is composed of a member 8 on which dots made of a liquid resin adhesive are formed, a holding means 7 for holding the member, an injection head 11 mounted on a moving apparatus which is movable while being arranged on the position facing to the member, a dot forming information input means and a dot forming control means. Therein, the liquid resin adhesive used in the liquid resin adhesive dot forming apparatus is made of a material which can be cured by light or heat and, at the same time, a liquid resin adhesive supply means comprises a tube of intercepting light which cures the liquid resin adhesive. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006007210(A) 申请公布日期 2006.01.12
申请号 JP20050160026 申请日期 2005.05.31
申请人 RICOH CO LTD 发明人 SEKIYA TAKURO;MIYAGUCHI YOICHIRO;HAYASHI YASUAKI
分类号 B05D7/24;B05C5/00;B05D1/26;B41J2/01;H01L21/027 主分类号 B05D7/24
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