| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion properties between the substrate of a circuit device and the insulating film between elements. SOLUTION: Circuit elements, such as a plurality of semiconductor elements 142a, 142b and a passive element 144, buried into an insulating resin film 122, are provided on a metal base 140 whose surface roughness Ra ranges from 0.3 to 10μm, thus operating an anchor effect between the base 140 and the insulating resin film 122 and improving the adhesion properties between the base 140 and the insulating resin film 122. COPYRIGHT: (C)2006,JPO&NCIPI |
