发明名称 APPARATUS AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To facilitate the formation of a circuit pattern on a board without necessitating so many manufacturing processes. SOLUTION: The printed circuit board manufacturing apparatus 1 comprises a mounting table 18 for mounting a board 2 thereon, a mixing container 8 for producing a mixed fluid 3a by melting an organic copper compound 3 into a supercritical carbon dioxide 7a, a head 5 arranged opposite to the board 2 on the mounting table 18 for ejecting the mixed fluid 3a toward the surface of the board 2, a travelling mechanism 14 for moving the head 5 along the wiring route for the formation of the pattern 3c in the board 2 on the mounting table 18, and a laser source 9 for heating the mixed fluid 3a by laser irradiation just before the landing of the mixed fluid 3a blowing out from the travelling head 5 on the surface of the board 2 for the fusion of the copper component of the mixed fluid 3a onto the surface of the board 2 for the formation of the circuit pattern 3c. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006013321(A) 申请公布日期 2006.01.12
申请号 JP20040191403 申请日期 2004.06.29
申请人 CHUBU ELECTRIC POWER CO INC;SHOWA ELECTRIC WIRE & CABLE CO LTD 发明人 NAGAYA SHIGEO;FURUMURA SEIJI;WATANABE AKIZO;MORITA HIROAKI;HIRAI SUSUMU;NAKAMOTO TAKAO;TANAKA AKIRA
分类号 H05K3/10 主分类号 H05K3/10
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