| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device suppressing or preventing by-products from being deposited on a closing means of airtightly closing a substrate carry-in/out opening formed on a processing furnace. SOLUTION: The substrate processing device is provided with a furnace opening shutter 116 which airtightly closes the wafer carry-in/out opening 131 at a lower part of the processing furnace 202 when a wafer 200 is not put in the processing furnace 202. The wafer 200 is put and processed and also provided with a heating heater 132 which heats the furnace opening shutter 116, and when the wafer 200 is not put in the processing furnace 202, the furnace opening shutter 116 is heated. COPYRIGHT: (C)2006,JPO&NCIPI
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