| 摘要 |
PROBLEM TO BE SOLVED: To improve quality of bonding using a solder in a semiconductor device wherein a surface-mounted electronic component and a wiring electrode provided on a substrate on which the electronic component is mounted, are bonded by an Sn-Zn system lead-free solder. SOLUTION: A plurality of electrode terminals 2 are provided on the surface of an electronic component 1 facing a substrate 3, and a plurality of protruded and recessed wiring electrodes 4 are provided in an area that faces the electrode terminals 2 on the principal surface of the substrate 3. Thus, an inter-metal chemical compound layer to be generated in a bonding part after mounting the electronic component 1 on the substrate is protruded and recessed and stress to be generated is diffused in parts other than the inter-metal chemical compound layer. COPYRIGHT: (C)2006,JPO&NCIPI
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