发明名称 PACKAGING MATERIAL FOR ELECTRONIC DEVICE, AND METHOD FOR CHANGING SPECIFICATION OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a packaging material which enables a specification change of an electronic device that is kept packaged, and a method for changing the specification of the electronic device using the packaging material. SOLUTION: The packaging material 10 is used for a projector 1 which has a projecting portion 11 and is connected to a computer to rewrite data in an internal memory thereof. The packaging material 10 comprises a packaging box 6 in which the projector 1 is housed, and a front buffer material 2 and a rear buffer material 3 which protect the projector 1 in the packaging box 6 from impact. Incisions 6A are formed on the packaging box 6 to form a plurality of openable/closable through-holes 61, 62, 63. Holes 21 and 31, 32 are formed on the front buffer material 2 and the rear buffer material 3 at the positions where the holes 21, 31, 32 at the position correspond to the through-holes 61, 62, 63, respectively are provided, to form openings 10A. A power cable sockets 12, a computer connection cable socket 13, and the projecting portion 11 of the projector 1 packaged with the packaging material 10 are exposed to the outside through the openings 10A. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006008191(A) 申请公布日期 2006.01.12
申请号 JP20040188679 申请日期 2004.06.25
申请人 FUNAI ELECTRIC CO LTD 发明人 NOHATA YUKIKAZU
分类号 B65D85/68;B65D5/50;B65D5/54;B65D81/07;B65D81/113 主分类号 B65D85/68
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