发明名称 |
Method for forming insulating film on substrate, method for manufacturing semiconductor device and substrate-processing apparatus |
摘要 |
A substrate-processing apparatus ( 100, 40 ) comprises a radical-forming unit ( 26 ) for forming the nitrogen radicals and oxygen radicals through a high-frequency plasma, a processing vessel ( 21 ) in which a substrate (W) to be processed is held, and a gas-supplying unit ( 30 ) which is connected to the radical-forming unit. The gas-supplying unit ( 30 ) controls the mixture ratio between a first raw material gas containing the nitrogen and a second raw material gas containing oxygen, and supplies a mixture gas of a desired mixture ratio to the radical-forming unit. By supplying the nitrogen radicals and oxygen radicals mixed at the controlled mixture ratio to the surface of the substrate, an insulating film having a desired nitrogen concentration is formed on the surface of the substrate.
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申请公布号 |
US2006009044(A1) |
申请公布日期 |
2006.01.12 |
申请号 |
US20050527642 |
申请日期 |
2005.03.14 |
申请人 |
IGETA MASANOBU;AOYAMA SHINTARO;SHINRIKI HIROSHI |
发明人 |
IGETA MASANOBU;AOYAMA SHINTARO;SHINRIKI HIROSHI |
分类号 |
C23C16/00;H01L21/31;H01L21/00;H01L21/314;H01L21/318;H01L29/78 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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