| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which preferably prevents a resin leakage in a sealing process, and is hard to be a hindrance to an adhered tape in a series of processes or a process of separating the tape. <P>SOLUTION: The method for manufacturing the semiconductor device includes at least: the mounting step of bonding a plurality of semiconductor chips 15 on the die pad 11c of a lead frame 10 made of a metal obtained by adhering a heat-resistant adhesive tape 20 to an outer pad side; the wire connecting step of electrically connecting the pointed end of the terminal of the lead frame 10 to an electrode pad 15a on the semiconductor chip 15 by a bonding wire; the sealing step of one-face sealing the side of the semiconductor chip 15 by a sealing resin 17; and the cutting step of cutting a sealed structure to a semiconductor device 21a individually. As the heat-resistant adhesive tape 20, a tape is used which comprises at least a substrate layer 20a having a heat resistance, and an adhesive layer 20b which is configured to contain acrylic system adhesives and to have a weight average molecular amount of soluble components of 500,000 or more. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
