| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a downsized optodevice that is positioned with precision, is manufactured at a relatively low cost, and is relatively high in heat radiation performance. <P>SOLUTION: An optical semiconductor element 4 and a plurality of lead frames 2 are sealed by a molding resin 1, and a heat conducting member 8 higher in thermal conductivity than the molding resin 1 is arranged in a recess 9 formed in the surface of the molding resin 1. The inner lead frames 2b of the lead frames 2 are exposed on the inner walls of the well 9 for the heat conducting material 8 to contact with the inner lead frames 2b. The heat produced by the optical semiconductor element 4 is transmitted from the inner lead frames 2b mounted with the optical semiconductor element 4 to other inner lead frames 2b through the heat conducting member 8. The transmission of heat through the inner lead frames 2b to the entirety molding resin 1 reduces temperature distribution deviation. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
