发明名称 ULTRASONIC JOINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an ultrasonic joining apparatus maintaining stable joining quality without a deterioration in vibration transmission even if bonding is repeated. <P>SOLUTION: A bonding tool 30 is brought into contact with a component P on the other principal plane. The component P has a metal joint P1 formed on one of principal planes, and a smooth surface formed on the other principal plane. Pressurizing force and ultrasonic vibration are applied to the component P to join the metal joint P1 with a surface B to be joined. A contact surface 31 with the component of the bonding tool is made into a smooth surface, and in addition fine particles 33 made of the same material as that of the component P with a particle diameter of 10-100 nm are dispersively attached to the contact surface 31. Intermolecular force working between the particles 33 and the component P improves vibration transmission from the bonding tool 30 to the component P and improves joint quality. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006013297(A) 申请公布日期 2006.01.12
申请号 JP20040191032 申请日期 2004.06.29
申请人 MURATA MFG CO LTD 发明人 HIGASHIYAMA YUZO
分类号 H01L21/607 主分类号 H01L21/607
代理机构 代理人
主权项
地址