| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic laminated substrate high in reliability wherein chipping is inhibited along peripheral ridges, crack occurrence is suppressed, ceramic is prevented from scattering, and therefore electric connection is established without impediments between electrode patterns formed on the substrate surfaces and other circuit elements. <P>SOLUTION: In this ceramic laminated substrate, an internal wiring layer is provided inside, surface wiring layers are provided on both main surfaces and a plurality of first dividing grooves, and a plurality of second dividing grooves squarely crossing the first dividing grooves are formed on both main surfaces. An impact absorbing layer is formed along the periphery of a least one of the main surfaces. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
