发明名称 METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer electronic component, such as a multilayer ceramic capacitor having low costs, that has high stacking properties (adhesion properties in lamination), can form an electrode layer appropriately and precisely, and can reduce nonadhesion defects (nonlamination) and short-circuiting fraction defectives. SOLUTION: The method for manufacturing the multilayer electronic component contains a process for forming a separation layer containing a dielectric on a support sheet before forming the electrode layer on the support sheet; and a process for forming an adhesive layer on a surface at the side of an opposite electrode layer of a green sheet containing the electrode layer for laminating the green sheet having the electrode layer via the adhesive layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006013247(A) 申请公布日期 2006.01.12
申请号 JP20040190260 申请日期 2004.06.28
申请人 TDK CORP 发明人 SATO SHIGEKI
分类号 H01G4/12;B28B1/30;B28B11/00;H01G4/30 主分类号 H01G4/12
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