发明名称 PROXIMITY SWITCH AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a proximity switch of high reliability and its manufacturing method with uncomplicated manufacturing processes and free from crack of resin after manufacturing. SOLUTION: The proximity switch is provided with a reed switch 1, the surrounding of which is integrally molded with a resin part B, and the reed switch 1 is supported by a resin block 10. The manufacturing method of the proximity switch is a method of filling filler resin in a molding die and integrally molding the surrounding of the reed switch 1 with the resin part B, in which, after the resin block 10 is arranged inside the molding die and the reed switch 1 is made supported by the resin block 10, the filler resin is filled in the molding die to mold the resin part B. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006012727(A) 申请公布日期 2006.01.12
申请号 JP20040191690 申请日期 2004.06.29
申请人 OKI SENSOR DEVICE CORP 发明人 NAKAKUKI MINORU
分类号 H01H36/00;H01H11/00 主分类号 H01H36/00
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