| 摘要 |
PROBLEM TO BE SOLVED: To provide an easy, low-cost method for detecting the site of a malfunction which can detect the site of a malfunction even for an electronic component which requires the inputting of a complex signal pattern for detection or an electronic component which is vulnerable to light. SOLUTION: The method comprises a process for removing a part of a sealant of an electronic component, a resin sealing process for coating the inside of the electronic component with thermosetting resin and seals it with a shielding member which is effective for the prevention of a leak of the thermosetting resin and light shielding, a process for operating the electronic component for a predetermined period of time by supplying it with power and signals, a process, for terminating operations when a part of the thermosetting resin coating the electronic component is cured so as the locate the site of a malfunction, using observation means, and a process for returning to the resin sealing process after removing all the coated thermosetting resin and adjusting the curing temperature and operating conditions of the electronic component when the part of the thermosetting resin is not cured so as to locate no site of a malfunction. COPYRIGHT: (C)2006,JPO&NCIPI
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