| 摘要 |
PROBLEM TO BE SOLVED: To enable bonding without damaging characteristics of a work when a fine wire is subjected to ball bonding to the workpiece. SOLUTION: In the ball bonding method wherein discharge is carried out between a tip of the fine wire 10 extended from a capillary and a discharge electrode, a ball for junction is formed at the tip of the fine wire by fusing the tip of the fine wire, and the fine wire is subjected to bonding to the workpiece by pressing the ball in contact with the workpiece 20 when a ball is formed by discharging between the discharge electrode and the fine wire 10, a discharge position between the discharge electrode and the fine wire is set at a position apart from the workpiece by at least a distance which prevents characteristics of the workpiece from being damaged by discharge, and discharge is carried out. COPYRIGHT: (C)2006,JPO&NCIPI
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