| 摘要 |
<p>Fabricating resistive heater assembly (10) by providing first substrate layer, bonding second substrate layer to the first substrate layer, optionally bonding a hydrophobic layer to the second substrate layer, and bonding top layer to the optional hydrophobic layer or bonding the top layer to the second substrate layer. The second substrate layer has resistive heater and conductive traces electrically coupled to the resistive heater. Fabricating resistive heater assembly comprises providing first substrate layer (20), bonding second substrate layer (30) to the first substrate layer, optionally bonding a hydrophobic layer (60) to the second substrate layer, and bonding top layer (70) to the optional hydrophobic layer or bonding the top layer to the second substrate layer. The second substrate layer has resistive heater (40) and conductive traces (50) electrically coupled to the resistive heater. The top layer includes manifolding (80) for the gas to complete the resistive heater assembly. Independent claims are included for: (1) resistive heater assembly comprises source substance containing chamber with aperture, thin resistive heater disposed to be immersed in the source substance, and conductive traces electrically coupled to the thin resistive heater. The thin resistive heater is suspended across the aperture; and (2) using resistive heater assembly comprising providing chamber and resistive heater, introducing source of substance into the chamber, disposing the source substance in thermal contact with resistive heater, and applying current to the resistive heater through the conductive traces to heat the source substance to generate a gas.</p> |
