| 摘要 |
<p>PURPOSE: A semiconductor package is provided to decrease the number of whole manufacturing processes and to reduce manufacturing cost, by making a circuit board directly connected to a semiconductor chip during a process for manufacturing the semiconductor package. CONSTITUTION: The semiconductor chip(1) has the first and second surfaces(1a,1b). A plurality of input/output pads(2) are formed on the second surface. A resin layer(11) has the first and second surfaces(11a,11b). A groove(14) of a predetermined depth is formed in the resin layer to position the semiconductor chip. A ball land(12b) of a predetermined size is radially formed outside the groove. One end of a circuit pattern(12) is connected to the input/output pads of the semiconductor chip. An encapsulation material(20) encapsulates the semiconductor chip and a peripheral region near the groove of the circuit board(10). A plurality of conductive balls(30) are melted and adhered to the ball land of the circuit pattern of the circuit board.</p> |
